Written by: Ted Johansson

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Until recently, the use of silicon for the production of wireless integrated power amplifiers has not been viable. Here, however, the author describes how a revolutionary new grounding method makes this technique possible. Wireless-Trench technology was first applied to an integrated power output amplifier for the DECT system—a digital wireless standard for home and office handsets. Using this same technical approach, Ericsson is currently developing a family of related power amplifier products for GSM 900 and 1800/1900MHz as well as GSM dual/triple-band, PDC, other cordless systems, and Bluetooth.

[First published in Ericsson Review no. 01, 2001]