Ericsson introduces a new surface-mounted version of its second generation of digital Advanced Bus Converter (ABC) products, called the BMR456-SI. High-efficiency, digitally controlled DC/DC converter compliant to full surface-mount manufacturing processes; high-precision tooled pins guarantee high co-planarity and robustness. Highly advanced firmware integrated in the BMR456-SI contributes towards significant reduction in energy consumption. Tightly regulated output voltage (±2%) over the full operational range of 36V to 75V. Output power up to 468W for datacom applications.

BMR456-SI is based upon the FRIDA II platform, which was announced last year, both the surface-mount BMR456-SI and the through-hole BMR456-PI quarter-brick 3E* Advanced Bus Converters deliver unprecedented performance to system architects that are developing equipment for ICT (Information and Communication Technology) applications. These applications require fast response time, tightly regulated intermediate bus voltages and high efficiency at any point of operation to reduce power consumption.

Since the shipment of the first surface-mount version of the company’s FRIDA platform in 2010, the platform has enjoyed significant adoption with the growing demand for high-power DC/DC modules to power highly integrated surface-mount boards. "Ericsson is the only company in the industry to offer high-power DC/DC modules that are digitally controlled and also offer a surface-mount option," said Patrick Le Fèvre, Marketing and Communication Director, Ericsson Power Modules. "The addition of a surface-mount version to the PMBus compliant FRIDA II BMR456 DC/DC converter family is an indication of the strong market demand for highly integrated power technology that can also make a significant contribution to reducing energy consumption."

Board density is increasing and to simplify manufacturing processes, power module suppliers need to offer surface-mount alternatives to conventional through-hole versions. Although it is not necessarily an issue at low- and mid-power levels, it can be a significant challenge for high power modules and even more so when these modules require additional I/O.

* 3E stands for: Enhanced Performance, Energy Management, and End-user Value.