Silicon photonics uses silicon as a miniaturized optical medium for transmitting and switching data at very high speeds. In the recently concluded IRIS project, we demonstrated the full potential of silicon photonics technology, integrating in a silicon chip only a few millimeters large thousands of complex nanoscale optical circuits that are able to process Terabit/s of data, as well as the relevant control electronic circuits.
This is a world record – never before have so many optical circuits been integrated together with their electrical control circuits on the same 3D chip.
What is more, they can be mass produced at low cost and with high miniaturization, unleashing a range of new optical devices for 5G networks, data centers and optical transport networks. The project results exceeded expectations and the integrated switch device performed better than the specifications defined in the early phase of the project. Learn more here!
We have fabricated a silicon photonic switch with the highest scale of integration (more than thousand circuits) and the highest number of different functions ever implemented before on a single chip. We are also realizing the most advanced 3D electrical interconnect between a photonic chip and its control electronic chip.
This was done as part of IRIS, a 7th Framework Program for Research and Technological Development (FP7). In this post we’ll share details about the progress we have made recently in the project.
Disruptive telecom concepts like NFV promise agility and high velocity of service innovation and deployment. These requirements call for a novel management paradigm beyond traditional telco workflows and processes. Together with our partners in the EU-FP7-funded UNIFY project, we tackle these challenges by taking inspiration from DevOps ideas widely applied at scale in data centers. Discuss with us our recently released SP-DevOps Toolkit, and how it helps showcase ideas that could usher a next generation of tools for telecom services in software-defined infrastructures.