The new license package, called K-D1, is intended to provide semiconductor companies and integrating OEM’s with a competitive, Bluetooth radio core, thereby enhancing time-to-market.

What makes the K-D1 package so unique is its completely portable design, enabling customers to differentiate their products not only for various manufacturing processes, but also for different market segments. The package includes evaluation hardware and design database, as well as simulation results and schematics. Furthermore, qualified samples manufactured in the foundry mother process are also included. This has been proven to accelerate the process of porting and to minimize engineering efforts.

“We are proud to offer our customers the fruits of our many years of Bluetooth radio development coupled with our vast working experience within various process technologies,” says Maria Khorsand, President of Ericsson Technology Licensing.

The product design behind K-D1 belongs to the fourth generation family of Bluetooth radio designs from Ericsson. Using only 6 mm2 of silicon, it is currently the only complete, on-chip integration of the radio front-end, effectively eliminating the considerable production steps associated with module design and manufacturing.

“Whereas two-chip and single-chip modules have played important roles in the early Bluetooth market, the increasing demand for module-free solutions represents a natural step in the evolution towards reduced cost and footprint requirements,” says Maria Khorsand.